Invention Grant
- Patent Title: Indium-containing lead-free solder for vehicle-mounted electronic circuits
- Patent Title (中): 用于车载电子电路的含铟无铅焊料
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Application No.: US12452665Application Date: 2008-07-17
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Publication No.: US08888932B2Publication Date: 2014-11-18
- Inventor: Yuji Kawamata , Minoru Ueshima , Tomu Tamura , Kazuhiro Matsushita , Masashi Sakamoto
- Applicant: Yuji Kawamata , Minoru Ueshima , Tomu Tamura , Kazuhiro Matsushita , Masashi Sakamoto
- Applicant Address: JP Tokyo
- Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee: Senju Metal Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agent Michael Tobias
- Priority: JP2007-187457 20070718
- International Application: PCT/JP2008/062932 WO 20080717
- International Announcement: WO2009/011392 WO 20090122
- Main IPC: B23K35/34
- IPC: B23K35/34 ; C22C13/00 ; B23K35/26 ; H05K3/34
Abstract:
A lead-free solder alloy which can be used for soldering of vehicle-mounted electronic circuits and which exhibits high reliability is provided.The alloy consists essentially of Ag: 2.8-4 mass %, In: 3-5.5 mass %, Cu: 0.5-1.1 mass %, if necessary Bi: 0.5-3 mass %, and a remainder of Sn. In is at least partially in solid solution in the Sn matrix.
Public/Granted literature
- US20100307823A1 INDIUM-CONTAINING LEAD-FREE SOLDER FOR VEHICLE-MOUNTED ELECTRONIC CIRCUITS Public/Granted day:2010-12-09
Information query
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