Invention Grant
US08889463B2 Sloped structure, method for manufacturing sloped structure, and spectrum sensor 有权
斜坡结构,倾斜结构的制造方法和光谱传感器

Sloped structure, method for manufacturing sloped structure, and spectrum sensor
Abstract:
A method for manufacturing a sloped structure is disclosed. The method includes the steps of: (a) forming a sacrificial film above a substrate; (b) forming a first film above the sacrificial film, the first film having a first portion connected to the substrate, a second portion located above the sacrificial film, a third portion located between the first portion and the second portion, and a thin region in a portion of the third portion or in a boundary section between the second portion and the third portion and having a thickness smaller than the first portion; (c) removing the sacrificial film; and (d) bending the first film in the thin region, after the step (c), thereby sloping the second portion of the first film with respect to the substrate.
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