Invention Grant
- Patent Title: Deformable apparatus and method
- Patent Title (中): 可变形的装置和方法
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Application No.: US13435372Application Date: 2012-03-30
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Publication No.: US08895864B2Publication Date: 2014-11-25
- Inventor: Darryl Cotton , Samiul Md Haque , Piers Andrew
- Applicant: Darryl Cotton , Samiul Md Haque , Piers Andrew
- Applicant Address: FI Espoo
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Main IPC: H05K3/20
- IPC: H05K3/20 ; H05K1/00
Abstract:
An apparatus and method wherein the apparatus includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.
Public/Granted literature
- US20130256004A1 Deformable Apparatus and Method Public/Granted day:2013-10-03
Information query
