A semiconductor device includes a semiconductor chip, a die pad having a chip mount surface for mounting the semiconductor chip, and an electrode terminal for connecting with the semiconductor chip through first and second wirings. The electrode terminal has a first surface including a connection point with the first wiring and a second surface including a connection point with the second wiring. The connection point with the first wiring is located at a first height from a reference plane extending from the chip mount surface. The connection point with the second wiring is located at a second height different from the first height from the reference plane.