Invention Grant
US08896300B2 2D coil and a method of obtaining EC response of 3D coils using the 2D coil configuration 有权
2D线圈和使用2D线圈配置获得3D线圈的EC响应的方法

  • Patent Title: 2D coil and a method of obtaining EC response of 3D coils using the 2D coil configuration
  • Patent Title (中): 2D线圈和使用2D线圈配置获得3D线圈的EC响应的方法
  • Application No.: US12832620
    Application Date: 2010-07-08
  • Publication No.: US08896300B2
    Publication Date: 2014-11-25
  • Inventor: Benoit Lepage
  • Applicant: Benoit Lepage
  • Applicant Address: US MA Waltham
  • Assignee: Olympus NDT Inc.
  • Current Assignee: Olympus NDT Inc.
  • Current Assignee Address: US MA Waltham
  • Agency: Ostrolenk Faber LLP
  • Main IPC: G01N27/72
  • IPC: G01N27/72 G01N27/90
2D coil and a method of obtaining EC response of 3D coils using the 2D coil configuration
Abstract:
The invention herein disclosed provides a 2D coil and a method of using the 2D wound EC sensor for reproducing the Eddy Current Testing (ECT) response of a prior art 3D orthogonal sensor. The 3D orthogonal sensor is conventionally wound onto a 3D core, with at least some of the surfaces being un-parallel to the surface be inspected. Using the herein disclosed 2D configuration allows the use of printed circuit board technologies for the manufacturing of these EC sensors. The herein disclosed method and the associated 2D EC sensors are particularly useful for reproducing the EC effect of conventional orthogonal probe arrays.
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