Invention Grant
- Patent Title: Semiconductor modules
- Patent Title (中): 半导体模块
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Application No.: US13615373Application Date: 2012-09-13
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Publication No.: US08896340B2Publication Date: 2014-11-25
- Inventor: Tae Jin Kang
- Applicant: Tae Jin Kang
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2012-0033486 20120330
- Main IPC: H03K19/003
- IPC: H03K19/003

Abstract:
Semiconductor modules are provided. The semiconductor module includes semiconductor chips with one or more ranks. The semiconductor module includes a mode register configured for storing a first information signal whose logic level is set or determined according to a number of the ranks and an on-die termination (ODT) controller configured for generating an internal control signal for activating an ODT circuit in response to the first information signal. The internal control signal is enabled during a read operation or disabled during a write operation.
Public/Granted literature
- US20130257474A1 SEMICONDUCTOR MODULES Public/Granted day:2013-10-03
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