Invention Grant
- Patent Title: Acoustic wave device and module including a dielectric film with an inclined upper surface
- Patent Title (中): 声波装置和模块包括具有倾斜上表面的电介质膜
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Application No.: US13725514Application Date: 2012-12-21
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Publication No.: US08896399B2Publication Date: 2014-11-25
- Inventor: Michio Miura , Satoru Matsuda , Takashi Yamashita , Hiraki Domon
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Main IPC: H03H9/64
- IPC: H03H9/64 ; H03H9/25 ; H03H9/02 ; H03H3/08

Abstract:
An acoustic wave device includes: a substrate; a dielectric film formed on the substrate; opposing comb-shaped electrodes located between the substrate and the dielectric film, each of the opposing comb-shaped electrodes including an electrode finger, wherein at least one of the substrate and the dielectric film is a piezoelectric substance, an upper surface of the dielectric film, which is located above a gap between a tip of an electrode finger of one of the opposing comb-shaped electrodes and the other of the opposing comb-shaped electrodes, is inclined against an upper surface of the substrate in an extension direction of the electrode finger, and an inclination angle of the upper surface of the dielectric film against the upper surface of the substrate is equal to or larger than 30° and equal to or smaller than 50°.
Public/Granted literature
- US20130106536A1 ACOUSTIC WAVE DEVICE AND MODULE Public/Granted day:2013-05-02
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