Invention Grant
- Patent Title: Laminated coil
- Patent Title (中): 层压线圈
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Application No.: US13611940Application Date: 2012-09-12
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Publication No.: US08896406B2Publication Date: 2014-11-25
- Inventor: Satoshi Yamamoto
- Applicant: Satoshi Yamamoto
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2011-203083 20110916
- Main IPC: H01F27/30
- IPC: H01F27/30 ; H01F5/00 ; H01F27/28 ; H01F27/32

Abstract:
A laminated coil includes a plurality of circular conductive plates in the form of a flat plate, each of the circular conductive plates being laminated via an insulating material in an axis direction. The plurality of circular conductive plates each include a plurality of concentric circular arc parts having different inner diameter and outer diameter from each other, and a connection part interconnecting the plurality of circular arc parts. The plurality of circular conductive plates are arranged such that the connection parts thereof face each other and the circular arc parts thereof are juxtaposed to each other in a radial direction.
Public/Granted literature
- US20130069754A1 LAMINATED COIL Public/Granted day:2013-03-21
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