The present invention discloses a repairing line system, which includes a plurality of packages, a substrate having a plurality of data lines awaiting for repair, two repairing lines, and two connecting lines. The repairing line includes outgoing lines led from the packages and a wire disposed on three sides of the substrate without the packages disposed and coupled to the outgoing lines. The wires insulatively intersect second terminals of the data lines awaiting for repair. The connecting line insulatively intersects the outgoing lines and first terminals of the data lines. The present invention further discloses a repair method of the repairing line system. The repairing line system and the repair method of the present invention utilize the same repairing lines led from different packages to connect with each other for forming whole connected wires, thereby increasing flexibility of the repairing line system in repairing data lines.