Invention Grant
- Patent Title: Method for manufacturing a suspension board assembly sheet with circuits
- Patent Title (中): 具有电路的悬挂板组装片的制造方法
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Application No.: US13888889Application Date: 2013-05-07
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Publication No.: US08897024B2Publication Date: 2014-11-25
- Inventor: Terukazu Ihara , Tetsuya Ohsawa
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2009-207662 20090909
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/00 ; H05K1/02 ; G11B5/48 ; H05K1/05
Abstract:
An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards.
Public/Granted literature
- US20130247371A1 METHOD FOR MANUFACTURING A SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS Public/Granted day:2013-09-26
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