Invention Grant
- Patent Title: Systems and methods for compressing headers and payloads
- Patent Title (中): 用于压缩报头和有效载荷的系统和方法
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Application No.: US13663837Application Date: 2012-10-30
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Publication No.: US08897298B2Publication Date: 2014-11-25
- Inventor: Maarten Menzo Wentink
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Charles E. Eggers
- Main IPC: H04L12/28
- IPC: H04L12/28 ; H04L29/06 ; H04W52/02 ; H03M7/46 ; H04W28/06

Abstract:
Methods, devices, and computer program products for compressing packet headers and payloads are described herein. In one embodiment, a packet including a packet header and a packet payload is compressed in accordance with a compression map, and the compressed packet is transmitted. The compression map includes a run-length encoded data set identifying at least one data field of the packet header and the packet payload to compress. In another embodiment, a packet including a packet header and a packet payload is received and decompressed in accordance with a decompression map. The decompression map includes a run-length encoded data set identifying at least one data field of the packet header and the packet payload to decompress.
Public/Granted literature
- US20130107895A1 SYSTEMS AND METHODS FOR COMPRESSING HEADERS AND PAYLOADS Public/Granted day:2013-05-02
Information query