Invention Grant
- Patent Title: Method for manufacture of multi-layer-multi-turn structure for high efficiency wireless communication
- Patent Title (中): 用于高效率无线通信的多层多匝结构的制造方法
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Application No.: US13233735Application Date: 2011-09-15
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Publication No.: US08898885B2Publication Date: 2014-12-02
- Inventor: Vinit Singh , Christine A. Frysz , Matthew Geary , Eitan Babcock , Justin Derbas
- Applicant: Vinit Singh , Christine A. Frysz , Matthew Geary , Eitan Babcock , Justin Derbas
- Applicant Address: US IL Chicago
- Assignee: NuCurrent, Inc.
- Current Assignee: NuCurrent, Inc.
- Current Assignee Address: US IL Chicago
- Agency: McDermott Will & Emery LLP
- Main IPC: H04R31/00
- IPC: H04R31/00 ; H01Q7/00 ; A61N1/372
Abstract:
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
Public/Granted literature
- US20130067738A1 Method for Manufacture of Multi-Layer-Multi-Turn Structure for High Efficiency Wireless Communication Public/Granted day:2013-03-21
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