A method for producing a laminated ceramic electronic component includes the steps of preparing ceramic green sheets, transferring an inner conductor pattern layer and a lead conductor pattern layer formed on a support on the ceramic green sheets to form the inner conductor and the lead conductor on the ceramic green sheets, laminating the ceramic green sheets to cover the inner conductor and the lead conductor, and firing the ceramic laminated product. In the step of forming the inner conductor and the lead conductor, the inner conductor pattern layer is transferred onto the ceramic green sheet a plurality of times so as to overlap each other, thereby forming the inner conductor, and the lead conductor pattern layer is transferred onto the ceramic green sheet, wherein the number of times of the transferring is less than the number of times of the transferring of the inner conductor pattern layer.