Invention Grant
- Patent Title: Method of making a connection component with hollow inserts
- Patent Title (中): 制造具有中空插入件的连接部件的方法
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Application No.: US12866687Application Date: 2009-02-19
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Publication No.: US08898896B2Publication Date: 2014-12-02
- Inventor: Francois Marion , Damien Saint-Patrice
- Applicant: Francois Marion , Damien Saint-Patrice
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
- Current Assignee: Commissariat a l'Energie Atomique et aux Energies Alternatives
- Current Assignee Address: FR Paris
- Agency: Harris Beach PLLC
- Priority: FR0851142 20080222
- International Application: PCT/FR2009/000186 WO 20090219
- International Announcement: WO2009/115686 WO 20090924
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H01L23/00 ; H05K3/34
Abstract:
The invention relates to a method for making a connection component that comprises a set of conducting inserts to be electrically connected with another component, said inserts being hollow.
Public/Granted literature
- US20110094789A1 CONNECTION COMPONENT WITH HOLLOW INSERTS AND METHOD FOR MAKING SAME Public/Granted day:2011-04-28
Information query
