Invention Grant
- Patent Title: Delamination drying apparatus and method
- Patent Title (中): 分层干燥装置及方法
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Application No.: US13650044Application Date: 2012-10-11
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Publication No.: US08898928B2Publication Date: 2014-12-02
- Inventor: Stephen M. Sirard , Diane Hymes , Alan M. Schoepp , Ratchana Limary
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Beyer Law Group LLP
- Main IPC: F26B13/30
- IPC: F26B13/30
Abstract:
An apparatus for delamination drying a substrate is provided. A chamber for receiving a substrate is provided. A chuck supports and clamps the substrate within the chamber. A temperature controller controls the temperature of the substrate and is able to cool the substrate. A vacuum pump is in fluid connection with the chamber. A tilting mechanism is able to tilt the chuck at least 90 degrees.
Public/Granted literature
- US20140101964A1 DELAMINATION DRYING APPARATUS AND METHOD Public/Granted day:2014-04-17
Information query
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