Invention Grant
- Patent Title: Electrical panel structures
- Patent Title (中): 电气面板结构
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Application No.: US13682608Application Date: 2012-11-20
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Publication No.: US08898974B1Publication Date: 2014-12-02
- Inventor: Brock Robert Gardner
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US NV Reno
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US NV Reno
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H02G3/22
- IPC: H02G3/22 ; E04C1/39 ; E04B1/61 ; E04B1/94

Abstract:
Electrical panel structures for a modular building system, such as a modular data center. The electrical panel structures provide a standardized structure for attachment of high voltage power, low voltage power, and/or data lines between rooms or components of the modular building system. The panel structures can include multiple conduits that extend between rooms or other components of a modular building structure. The panel structures can include, for example, conduits having couplers for the attachment of high voltage cables and/or pass-throughs for the passage of low voltage lines and/or data lines.
Information query
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