Invention Grant
- Patent Title: Air conditioner heat pump with injection circuit and automatic control thereof
- Patent Title (中): 空调热泵带注射电路及其自动控制
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Application No.: US11661094Application Date: 2006-03-27
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Publication No.: US08899058B2Publication Date: 2014-12-02
- Inventor: Fumitake Unezaki , Makoto Saitou , Tetsuji Saikusa , Masanori Aoki , Masato Yosomiya
- Applicant: Fumitake Unezaki , Makoto Saitou , Tetsuji Saikusa , Masanori Aoki , Masato Yosomiya
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney
- International Application: PCT/JP2006/306119 WO 20060327
- International Announcement: WO2007/110908 WO 20071004
- Main IPC: F25B41/00
- IPC: F25B41/00 ; F25B49/00 ; F25B13/00 ; F25B40/00 ; F25B1/10 ; F25B9/00

Abstract:
Heating equipment, including a first heat exchanger, a compressor, a second heat exchanger, and a first expansion valve that decompresses a refrigerant flowing from the second heat exchanger to the first heat exchanger, are connected so as to circulate the refrigerant. A third heat exchanger provides heat of the refrigerant flowing from the second heat exchanger to the first heat exchanger to the refrigerant flowing from the first heat exchanger toward the compressor. An injection circuit merges part of the refrigerant flowing from the second heat exchanger to the first heat exchanger with the refrigerant that is sucked by the compressor. An injection expansion valve is installed in the injection circuit and decompresses the refrigerant flowing in the injection circuit. A fourth heat exchanger is installed in the injection circuit to supply heat of the refrigerant flowing from the second heat exchanger toward the first heat exchanger to the refrigerant flowing in the injection circuit.
Public/Granted literature
- US20090071177A1 Refrigerant Air Conditioner Public/Granted day:2009-03-19
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