Invention Grant
- Patent Title: Cooling device
- Patent Title (中): 冷却装置
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Application No.: US13444001Application Date: 2012-04-11
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Publication No.: US08899307B2Publication Date: 2014-12-02
- Inventor: Shinsuke Nishi , Shogo Mori
- Applicant: Shinsuke Nishi , Shogo Mori
- Applicant Address: JP Aichi-Ken
- Assignee: Kabushiki Kaisha Toyota Jidoshokki
- Current Assignee: Kabushiki Kaisha Toyota Jidoshokki
- Current Assignee Address: JP Aichi-Ken
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2011-093183 20110419
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H01L23/473 ; H05K7/20

Abstract:
A cooling device includes a base, first and second heat generating parts connected to the base, first and second passages formed in the base and a partition wall disposed in the base. Liquid refrigerant flows through the first and the second passages for cooling the first and the second heat generating parts, respectively. The first and the second passages are stacked one above the other through the partition wall in the base. The partition wall includes a first region opened to allow liquid refrigerant in the first passage to flow into the second passage and a second region located on the side of the first region to allow liquid refrigerant in the first passage to flow toward the downstream end of the first passage. The first region is formed such that an opening area of the first region is greater than an opening area of the first passage.
Public/Granted literature
- US20120267074A1 COOLING DEVICE Public/Granted day:2012-10-25
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