Invention Grant
- Patent Title: Method for bonding refractory ceramic and metal
- Patent Title (中): 耐火陶瓷和金属的粘合方法
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Application No.: US12080213Application Date: 2008-04-01
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Publication No.: US08899470B2Publication Date: 2014-12-02
- Inventor: David M. Lineman , Wenchao Wang , Randy D. Ziegenhagen
- Applicant: David M. Lineman , Wenchao Wang , Randy D. Ziegenhagen
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Ryan T. Hardee
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K20/00 ; C04B37/02 ; C03B7/04

Abstract:
A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.
Public/Granted literature
- US20090142608A1 Method for bonding refractory ceramic and metal Public/Granted day:2009-06-04
Information query
IPC分类: