Invention Grant
US08899720B2 Fluid ejecting apparatus and maintenance method of fluid ejecting apparatus
有权
流体喷射装置和流体喷射装置的维护方法
- Patent Title: Fluid ejecting apparatus and maintenance method of fluid ejecting apparatus
- Patent Title (中): 流体喷射装置和流体喷射装置的维护方法
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Application No.: US13718620Application Date: 2012-12-18
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Publication No.: US08899720B2Publication Date: 2014-12-02
- Inventor: Sugata Yoshihisa
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2008-320064 20081216; JP2008-320066 20081216
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A fluid ejecting apparatus includes a fluid ejecting head in which nozzles are formed on a nozzle forming surface and corresponding maintenance devices. A supporting member supports each of the maintenance devices in a disposition state that corresponds to the fluid ejecting head. A simultaneous transfer mechanism moves the supporting member between a maintenance position, which is a position state where each of the maintenance devices approaches the corresponding fluid ejecting head, and a retracted position, which is a position state where each of the maintenance devices is separated from the corresponding fluid ejecting head. An individual transfer mechanism individually moves each of the maintenance devices on the supporting member, for each of a plurality of maintenance device groups including at least one maintenance device, along approaching and separating directions with respect to the fluid ejecting head that corresponds to the maintenance device included in the maintenance device group.
Public/Granted literature
- US20130106949A1 FLUID EJECTING APPARATUS AND MAINTENANCE METHOD OF FLUID EJECTING APPARATUS Public/Granted day:2013-05-02
Information query
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