Invention Grant
- Patent Title: Three-dimensional reconfigurable machining system
- Patent Title (中): 三维可重构加工系统
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Application No.: US13106141Application Date: 2011-05-12
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Publication No.: US08899890B2Publication Date: 2014-12-02
- Inventor: Jong-Kweon Park , Seung-Kook Ro , Byung-Sub Kim , Gyung-Ho Khim , Sung-Cheul Lee , Hyeon-Hwa Lee , Byung-In Kim
- Applicant: Jong-Kweon Park , Seung-Kook Ro , Byung-Sub Kim , Gyung-Ho Khim , Sung-Cheul Lee , Hyeon-Hwa Lee , Byung-In Kim
- Applicant Address: KR Daejeon
- Assignee: Korea Institute of Machinery & Materials
- Current Assignee: Korea Institute of Machinery & Materials
- Current Assignee Address: KR Daejeon
- Agency: Pearl Cohen Zedek Latzer Baratz LLP
- Priority: KR10-2010-0045590 20100514
- Main IPC: B23C1/12
- IPC: B23C1/12 ; B23Q1/54 ; B23Q1/44

Abstract:
Disclosed is a 3D reconfigurable machining system including a support frame spaced apart from the ground, a circular pivoting frame pivotably installed at the support frame, a slide member slidably installed on the circumferential portion of the pivoting frame, and a main spindle installed vertically at the slide member and being rotatable along the pivoting frame, so that a workpiece can be three-dimensionally machined with a considerably simple structure.
Public/Granted literature
- US20110280680A1 THREE-DIMENSIONAL RECONFIGURABLE MACHINING SYSTEM Public/Granted day:2011-11-17
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