Invention Grant
- Patent Title: Cutting tool
- Patent Title (中): 切割用具
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Application No.: US13637335Application Date: 2011-03-25
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Publication No.: US08900336B2Publication Date: 2014-12-02
- Inventor: Mitsuru Hasegawa , Masahiro Waki
- Applicant: Mitsuru Hasegawa , Masahiro Waki
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Priority: JP2010-070397 20100325
- International Application: PCT/JP2011/057387 WO 20110325
- International Announcement: WO2011/118782 WO 20110929
- Main IPC: C23C14/00
- IPC: C23C14/00 ; C23C14/06 ; C23C30/00 ; C23C14/34 ; C23C28/04 ; C23C28/00

Abstract:
A cutting tool in which wear resistance is improved by suppressing sudden chipping on the flank face while suppressing oxidation of the coating layer on the rake face, and thereby has a long lifespan even under cutting conditions in which deposition and edge damage easily occur. In the cutting tool, a coating layer represented by Ti1-a-b-cAlaWbMc(C1-xNx), with M selected as at least one of silicon, yttrium, and a metal belonging to group 4, 5, or 6 on the periodic table, excluding titanium and tungsten, and 0.3≦a≦0.6, 0.01≦b≦0.2, 0≦c≦0.2, and 0≦x≦1, being provided on the surface of a main cutting tool body having a flank face and a rake face, and the content ratio of tungsten on the flank face is higher than the content ratio of tungsten on the rake face.
Public/Granted literature
- US20130017026A1 CUTTING TOOL Public/Granted day:2013-01-17
Information query
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