Invention Grant
- Patent Title: Conductivity of resin materials and composite materials
- Patent Title (中): 树脂材料和复合材料的电导率
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Application No.: US12996025Application Date: 2009-06-05
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Publication No.: US08900486B2Publication Date: 2014-12-02
- Inventor: Martin Simmons , John Cawse
- Applicant: Martin Simmons , John Cawse
- Applicant Address: GB Duxford
- Assignee: Hexcel Composites Limited
- Current Assignee: Hexcel Composites Limited
- Current Assignee Address: GB Duxford
- Agent W. Mark Bielawski; David J. Oldenkamp
- Priority: GB0810453.1 20080607
- International Application: PCT/GB2009/001437 WO 20090605
- International Announcement: WO2009/147415 WO 20091210
- Main IPC: H01B1/24
- IPC: H01B1/24 ; C08K7/24 ; C08K7/06 ; C08G59/50 ; C08L53/00

Abstract:
A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.
Public/Granted literature
- US20110163275A1 CONDUCTIVITY OF RESIN MATERIALS AND COMPOSITE MATERIALS Public/Granted day:2011-07-07
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