Invention Grant
- Patent Title: Light-emitting device, method for manufacturing same, and molded part
- Patent Title (中): 发光装置及其制造方法和成型部件
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Application No.: US12026469Application Date: 2008-02-05
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Publication No.: US08900710B2Publication Date: 2014-12-02
- Inventor: Masaki Hayashi , Hiroto Tamaki , Masafumi Kuramoto , Tomohide Miki , Takayuki Sano , Tomohisa Kishimoto
- Applicant: Masaki Hayashi , Hiroto Tamaki , Masafumi Kuramoto , Tomohide Miki , Takayuki Sano , Tomohisa Kishimoto
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-026693 20070206
- Main IPC: B32B27/38
- IPC: B32B27/38 ; B29C45/02 ; B29C45/28 ; B29K63/00
Abstract:
A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.
Public/Granted literature
- US20080187762A1 LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, AND MOLDED PART Public/Granted day:2008-08-07
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