Invention Grant
- Patent Title: Epitaxial structures and methods of forming the same
- Patent Title (中): 外延结构及其形成方法
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Application No.: US13081257Application Date: 2011-04-06
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Publication No.: US08900915B2Publication Date: 2014-12-02
- Inventor: Joerg Rockenberger , Fabio Zürcher , Mao Takashima
- Applicant: Joerg Rockenberger , Fabio Zürcher , Mao Takashima
- Applicant Address: NO Oslo
- Assignee: Thin Film Electronics ASA
- Current Assignee: Thin Film Electronics ASA
- Current Assignee Address: NO Oslo
- Agency: Central California IP Group, P.C.
- Agent Andrew D. Fortney
- Main IPC: H01L31/078
- IPC: H01L31/078 ; H01L21/02 ; H01L31/068 ; H01L31/18

Abstract:
Epitaxial structures, methods of making epitaxial structures, and devices incorporating such epitaxial structures are disclosed. The methods and the structures employ a liquid-phase Group IVA semiconductor element precursor ink (e.g., including a cyclo- and/or polysilane) and have a relatively good film quality (e.g., texture, density and/or purity). The Group IVA semiconductor element precursor ink forms an epitaxial film or feature when deposited on a (poly)crystalline substrate surface and heated sufficiently for the Group IVA semiconductor precursor film or feature to adopt the (poly)crystalline structure of the substrate surface. Devices incorporating a selective emitter that includes the present epitaxial structure may exhibit improved power conversion efficiency relative to a device having a selective emitter made without such a structure due to the improved film quality and/or the perfect interface formed in regions between the epitaxial film and contacts formed on the film.
Public/Granted literature
- US20110240997A1 Epitaxial Structures, Methods of Forming the Same, and Devices Including the Same Public/Granted day:2011-10-06
Information query
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