Invention Grant
- Patent Title: Staggered column superjunction
- Patent Title (中): 交错列超级连接
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Application No.: US13900162Application Date: 2013-05-22
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Publication No.: US08900949B2Publication Date: 2014-12-02
- Inventor: Lingpeng Guan , Madhur Bobde , Anup Bhalla , Hamza Yilmaz
- Applicant: Lingpeng Guan , Madhur Bobde , Anup Bhalla , Hamza Yilmaz
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee Address: US CA Sunnyvale
- Agency: JDI Patent
- Agent Joshua D. Isenberg
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/78 ; H01L29/40 ; H01L29/10

Abstract:
A staggered column superjunction semiconductor device may include a cell region having one or more device cells. One or more device cells in the cell region include a semiconductor substrate configured to act as a drain and a semiconductor layer formed on the substrate. A first doped column may be formed in the semiconductor layer to a first depth and a second doped column may be formed in the semiconductor layer to a second depth. The first depth is greater than the second depth. The first and second columns are doped with dopants of a same second conductivity type and extend along a portion of a thickness of the semiconductor layer and are separated from each by a portion of the semiconductor layer.
Public/Granted literature
- US20130260522A1 STAGGERED COLUMN SUPERJUNCTION Public/Granted day:2013-10-03
Information query
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