Invention Grant
US08900987B1 Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices
有权
用于从层叠硅互连技术（SSIT）器件的不完全和有缺陷的插入器裸片去除凸块的方法
- Patent Title: Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices
- Patent Title (中): 用于从层叠硅互连技术（SSIT）器件的不完全和有缺陷的插入器裸片去除凸块的方法
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Application No.: US14046846Application Date: 2013-10-04
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Publication No.: US08900987B1Publication Date: 2014-12-02
- Inventor: Inderjit Singh , Raghunandan Chaware , Ganesh Hariharan , Glenn O'Rourke
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Agent Gerald Chan
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00
Abstract:
A method for removing bumps from incomplete interposer die(s) and/or defective interposer die(s) of an interposer wafer is described. The method includes forming bumps on an interposer wafer; identifying at least one incomplete interposer die and/or at least one defective interposer die of the interposer wafer; and removing bumps from the at least one incomplete interposer die and/or the at least one defective interposer die of the interposer wafer.
Information query
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