Invention Grant
- Patent Title: Adhesive for electronic components
- Patent Title (中): 电子部件用胶
-
Application No.: US13146571Application Date: 2010-01-29
-
Publication No.: US08901207B2Publication Date: 2014-12-02
- Inventor: Akinobu Hayakawa , Hideaki Ishizawa , Kohei Takeda , Ryohei Masui
- Applicant: Akinobu Hayakawa , Hideaki Ishizawa , Kohei Takeda , Ryohei Masui
- Applicant Address: JP Osaka
- Assignee: Sekisui Chemical Co., Ltd.
- Current Assignee: Sekisui Chemical Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: JP2009-018390 20090129
- International Application: PCT/JP2010/051253 WO 20100129
- International Announcement: WO2010/087444 WO 20100805
- Main IPC: C09J171/02
- IPC: C09J171/02 ; C09J163/00 ; C09J133/06 ; H01L23/29 ; H01L23/00 ; C08L33/06 ; C08L63/00
Abstract:
It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.
Public/Granted literature
- US20120016057A1 ADHESIVE FOR ELECTRONIC COMPONENTS Public/Granted day:2012-01-19
Information query
IPC分类:
