Invention Grant
- Patent Title: Composite wood board
- Patent Title (中): 复合木板
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Application No.: US13915968Application Date: 2013-06-12
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Publication No.: US08901208B2Publication Date: 2014-12-02
- Inventor: Roger Jackson , Tony Aindow , George Baybutt
- Applicant: Knauf Insulation SPRL
- Applicant Address: BE Vise
- Assignee: Knauf Insulation SPRL
- Current Assignee: Knauf Insulation SPRL
- Current Assignee Address: BE Vise
- Agency: Knauf Insulation SPRL
- Agent James K. Blodgett
- Main IPC: C08L97/02
- IPC: C08L97/02
Abstract:
In a stack of composite wood boards, the wood boards comprise wood particles and an organic binder.
Public/Granted literature
- US20140116291A1 Composite Wood Board Public/Granted day:2014-05-01
Information query
