Invention Grant
US08901432B2 Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board
有权
减轻由电路板的热膨胀或压缩引起的环形激光陀螺仪中的块弯曲
- Patent Title: Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board
- Patent Title (中): 减轻由电路板的热膨胀或压缩引起的环形激光陀螺仪中的块弯曲
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Application No.: US13250503Application Date: 2011-09-30
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Publication No.: US08901432B2Publication Date: 2014-12-02
- Inventor: Matthew Clark , Craig A. Galbrecht , George Goblish , Myles Koshiol
- Applicant: Matthew Clark , Craig A. Galbrecht , George Goblish , Myles Koshiol
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Fogg & Powers LLC
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02
Abstract:
An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.
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