Invention Grant
- Patent Title: Board unit and method of fabricating the same
- Patent Title (中): 板单元及其制造方法
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Application No.: US13422328Application Date: 2012-03-16
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Publication No.: US08901434B2Publication Date: 2014-12-02
- Inventor: Akihiro Yasuo , Koji Kuroda
- Applicant: Akihiro Yasuo , Koji Kuroda
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2011-061322 20110318
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/16 ; H05K1/00 ; H01R13/73 ; H05K3/30 ; H05K1/02 ; H05K3/42
Abstract:
A board unit includes a board that has a through hole penetrating the board from a first side of the board to a second side of the board and having a conductive inner wall surface a first electronic component that has a first connection pin to be press-fitted in the through hole from the first side of the board, and a conductive member that is disposed in the through hole to connect the inner wall surface of the through hole to the first connection pin.
Public/Granted literature
- US20120236523A1 BOARD UNIT AND METHOD OF FABRICATING THE SAME Public/Granted day:2012-09-20
Information query
