Invention Grant
- Patent Title: Bonding method and apparatus therefor
- Patent Title (中): 接合方法及其装置
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Application No.: US12277863Application Date: 2008-11-25
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Publication No.: US08901465B2Publication Date: 2014-12-02
- Inventor: Osamu Ohashi , Keiichi Minegishi , Yasunori Yoshida , Kouji Wada
- Applicant: Osamu Ohashi , Keiichi Minegishi , Yasunori Yoshida , Kouji Wada
- Applicant Address: JP Tokyo
- Assignee: SMC Kabushiki Kaisha
- Current Assignee: SMC Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-308147 20071129
- Main IPC: B23K13/01
- IPC: B23K13/01 ; C04B37/00 ; B23K20/02

Abstract:
A nitrogen gas tank, a rotary pump and a mechanical booster pump are connected to a bonding vessel that constitutes a bonding apparatus for carrying out diffusion bonding, the apparatus further comprising a pressure sensor. A nitrogen gas atmosphere is formed inside the bonding vessel, and under control operations of a control circuit, a nitrogen introduction rate is controlled so that a pressure is substantially fixed at a predetermined pressure between 3-105 Pa. At such a state, under the action of a rod of a hydraulic cylinder, a second electrode is brought into proximity with a first electrode, so that ultimately, a first object to be bonded and a second object to be bonded on the first electrode are pressed. Further, current is applied through the first electrode and the second electrode with respect to the first object to be bonded and the second object to be bonded.
Public/Granted literature
- US20090139646A1 BONDING METHOD AND APPARATUS THEREFOR Public/Granted day:2009-06-04
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