Invention Grant
- Patent Title: Semiconductor device and fabricating the same
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US13740373Application Date: 2013-01-14
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Publication No.: US08901607B2Publication Date: 2014-12-02
- Inventor: Chih-Hao Wang , Kuo-Cheng Ching , Gwan Sin Chang , Zhiqiang Wu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78

Abstract:
The present disclosure provides a semiconductor device. The semiconductor device includes a substrate having a gate region, source and drain (S/D) regions separated by the gate region and a first fin structure in a gate region in the N-FET region. The first fin structure is formed by a first semiconductor material layer as a lower portion, a semiconductor oxide layer as a middle portion and a second semiconductor material layer as an upper portion. The semiconductor device also includes a second fin structure in S/D regions in the N-FET region. The second fin structure is formed by the first semiconductor material layer as a lower portion and the semiconductor oxide layer as a first middle portion, the first semiconductor material layer as a second middle portion beside the first middle and the second semiconductor material layer as an upper portion.
Public/Granted literature
- US20140197456A1 Semiconductor Device and Fabricating the Same Public/Granted day:2014-07-17
Information query
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