Invention Grant
- Patent Title: Semiconductor device with super junction structure and method for fabricating the same
- Patent Title (中): 具有超结结构的半导体器件及其制造方法
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Application No.: US13364142Application Date: 2012-02-01
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Publication No.: US08901641B2Publication Date: 2014-12-02
- Inventor: Tsung-Hsiung Lee
- Applicant: Tsung-Hsiung Lee
- Applicant Address: TW Hsinchu
- Assignee: Vanguard International Semiconductor Corporation
- Current Assignee: Vanguard International Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device with a super-junction structure is provided, including: a semiconductor substrate having a first conductivity type; an epitaxial layer having the first conductivity type formed over the semiconductor substrate; a first doping region having the first conductive type formed in a portion of the epitaxial layer; a second doping region having a second conductivity type formed in a portion of the of the epitaxial layer; a third doping region having the second conductivity type formed in a portion of the of the epitaxial layer, wherein the doping region partially comprises doped polysilicon materials having the second conductivity type; a gate dielectric layer formed over the epitaxial layer, partially overlying the well region; and a gate electrode formed over a portion of the gate dielectric layer.
Public/Granted literature
- US20130193508A1 SEMICONDUCTOR DEVICE WITH SUPER JUNCTION STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2013-08-01
Information query
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