Invention Grant
- Patent Title: Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component
- Patent Title (中): 微机械部件的制造方法，相应的复合部件和相应的微机械部件
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Application No.: US13489124Application Date: 2012-06-05
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Publication No.: US08901684B2Publication Date: 2014-12-02
- Inventor: Hubert Benzel , Frank Henning , Armin Scharping , Christoph Schelling
- Applicant: Hubert Benzel , Frank Henning , Armin Scharping , Christoph Schelling
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102008002307 20080609
- Main IPC: G01L9/00
- IPC: G01L9/00 ; B81C3/00
Abstract:
A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.
Public/Granted literature
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