Invention Grant
US08901686B2 Mounting structure of chip type electric element and electric apparatus having chip type electric element on flexible board
有权
芯片式电气元件的安装结构和柔性板上带芯片型电气元件的电气设备
- Patent Title: Mounting structure of chip type electric element and electric apparatus having chip type electric element on flexible board
- Patent Title (中): 芯片式电气元件的安装结构和柔性板上带芯片型电气元件的电气设备
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Application No.: US13303337Application Date: 2011-11-23
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Publication No.: US08901686B2Publication Date: 2014-12-02
- Inventor: Satoru Hiramoto , Koichiro Matsumoto , Yoshiyuki Kono , Akitoshi Mizutani
- Applicant: Satoru Hiramoto , Koichiro Matsumoto , Yoshiyuki Kono , Akitoshi Mizutani
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Priority: JP2010-282544 20101220
- Main IPC: H01L29/82
- IPC: H01L29/82 ; H05K1/11 ; H05K1/18 ; H05K3/34

Abstract:
A mounting structure for mounting a chip type electric element on a flexible board includes: the flexible board having a first land, on which a first lead terminal of another electric element is soldered; and the chip type electric element having a long side. A whole of the long side of the chip type electric element faces a long side of the first land. A length of the long side of the first land is defined as IA, and a distance between one long side of the first land and one long side of the chip type electric element is defined as IB, the one long side of the first land facing the chip type electric element but opposite to the one long side of the chip type electric element. The length of IA is equal to or larger than the distance of IB.
Public/Granted literature
Information query
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