Invention Grant
- Patent Title: Transmission line formed adjacent seal ring
- Patent Title (中): 传输线相邻形成密封圈
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Application No.: US13916802Application Date: 2013-06-13
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Publication No.: US08901714B2Publication Date: 2014-12-02
- Inventor: Hsiao-Tsung Yen , Yu-Ling Lin , Cheng-Wei Luo , Chin-Wei Kuo , Chewn-Pu Jou , Min-Chie Jeng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/544 ; H01L29/93

Abstract:
An integrated circuit device includes a semiconductor body, active components formed over the semiconductor body, one or more seal rings surrounding the active components, and a signal line. One or more of the seal rings are configured to provide the primary return path for current flowing through the signal line.
Public/Granted literature
- US20140264745A1 Transmission Line Formed Adjacent Seal Ring Public/Granted day:2014-09-18
Information query
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