Invention Grant
- Patent Title: Methods and apparatus for package on package devices
- Patent Title (中): 封装器件封装的方法和装置
-
Application No.: US13463667Application Date: 2012-05-03
-
Publication No.: US08901730B2Publication Date: 2014-12-02
- Inventor: Ming-Kai Liu , Shih-Wei Liang , Hsien-Wei Chen , Kai-Chiang Wu
- Applicant: Ming-Kai Liu , Shih-Wei Liang , Hsien-Wei Chen , Kai-Chiang Wu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device is formed by connecting a top package and a bottom package together using a plurality of PoP connectors on the bottom package connected to corresponding connectors of the top package. The PoP device further comprises a plurality of dummy connectors contained in the bottom package and not connected to any corresponding connector in the top package.
Public/Granted literature
- US20130292831A1 Methods and Apparatus for Package on Package Devices Public/Granted day:2013-11-07
Information query
IPC分类:
