Invention Grant
- Patent Title: Microelectronic package with self-heating interconnect
- Patent Title (中): 具有自热互连的微电子封装
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Application No.: US13744639Application Date: 2013-01-18
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Publication No.: US08901753B2Publication Date: 2014-12-02
- Inventor: Daewoong Suh
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L23/492
- IPC: H01L23/492 ; H01L23/00 ; H01L23/498
Abstract:
A microelectronic package is provided. The microelectronic package includes a substrate having a plurality of solder bumps disposed on a top side of the substrate and a die disposed adjacent to the top side of the substrate. The die includes a plurality of glassy metal bumps disposed on a bottom side of the die wherein the plurality of glassy metal bumps are to melt the plurality of solder bumps to form a liquid solder layer. The liquid solder layer is to attach the die with the substrate.
Public/Granted literature
- US20130134587A1 MICROELECTRONIC PACKAGE WITH SELF-HEATING INTERCONNECT Public/Granted day:2013-05-30
Information query
IPC分类:
