Invention Grant
- Patent Title: Method and apparatus for surveying with a feature location
- Patent Title (中): 用于测量特征位置的方法和装置
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Application No.: US13234982Application Date: 2011-09-16
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Publication No.: US08902302B2Publication Date: 2014-12-02
- Inventor: Raymond E. Garvey, III , Jay P. Gatz , Paul W. Gress
- Applicant: Raymond E. Garvey, III , Jay P. Gatz , Paul W. Gress
- Applicant Address: US MO St. Louis
- Assignee: Emerson Electric Co.
- Current Assignee: Emerson Electric Co.
- Current Assignee Address: US MO St. Louis
- Agency: Luedeka Neely Group, P.C.
- Main IPC: H04N7/18
- IPC: H04N7/18 ; G01C15/00 ; G01V3/16

Abstract:
Methods are provided for conducting surveys of regions of interest, points of interest, and objects of interest. The methods typically involve using a survey instrument with programmed logic. The programmed logic may include one or more base of knowledge in an electronically accessible format, and may include statistical analysis software. The survey instrument generally includes a display and one or more sensors. The sensors may include a visible image or an infrared image sensor. The program logic may be used to guide an operator through a survey.
Public/Granted literature
- US20130070068A1 METHOD AND APPARATUS FOR SURVEYING WITH A FEATURE LOCATION Public/Granted day:2013-03-21
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