Invention Grant
- Patent Title: Inspection apparatus
- Patent Title (中): 检验仪器
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Application No.: US13993814Application Date: 2011-11-09
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Publication No.: US08902417B2Publication Date: 2014-12-02
- Inventor: Nobuaki Hirose , Takahiro Jingu , Hidetoshi Nishiyama , Kazuo Takahashi , Hisashi Hatano
- Applicant: Nobuaki Hirose , Takahiro Jingu , Hidetoshi Nishiyama , Kazuo Takahashi , Hisashi Hatano
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2010-289101 20101227
- International Application: PCT/JP2011/006246 WO 20111109
- International Announcement: WO2012/090373 WO 20120705
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/956 ; G01N21/95

Abstract:
This invention implements reduction in the amount of background-scattered light from a semiconductor wafer surface and highly sensitive inspection, without increasing the number of detectors. A surface inspection apparatus that detects defects on the surface of an object (semiconductor wafer surface) to be inspected, by irradiating the surface of the object with a beam of light such as laser light and detecting the light reflected or scattered from the surface; wherein a widely apertured lens with an optical Fourier transform function is disposed between the object to be inspected and a detector, a filter variable in position as well in aperture diameter is provided on a Fourier transform plane, and background-scattered light from the semiconductor wafer surface is effectively blocked, whereby only a signal from a defect such as a foreign substance is detected.
Public/Granted literature
- US20130271754A1 INSPECTION APPARATUS Public/Granted day:2013-10-17
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