Invention Grant
- Patent Title: Enhanced pinning property by inserted Si seed layer
- Patent Title (中): 通过插入Si种子层增强钉扎性能
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Application No.: US13923518Application Date: 2013-06-21
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Publication No.: US08902549B1Publication Date: 2014-12-02
- Inventor: Koujiro Komagaki , Kouichi Nishioka
- Applicant: Koujiro Komagaki , Kouichi Nishioka
- Applicant Address: NL Amsterdam
- Assignee: HGST Netherlands B.V.
- Current Assignee: HGST Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Patterson & Sheridan, LLP
- Main IPC: G11B5/127
- IPC: G11B5/127 ; G11B5/39
Abstract:
The embodiments of the present invention generally relate to a magnetic head having a silicon seed layer disposed between a lower shield and a metallic underlayer to enhance the unidirectional anisotropy in an antiferromagnetic layer disposed over the metallic underlayer.
Public/Granted literature
- US20140377588A1 ENHANCED PINNING PROPERTY BY INSERTED SI SEED LAYER Public/Granted day:2014-12-25
Information query
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