Invention Grant
- Patent Title: Multilayer ceramic electronic component
- Patent Title (中): 多层陶瓷电子元件
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Application No.: US13729911Application Date: 2012-12-28
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Publication No.: US08902563B2Publication Date: 2014-12-02
- Inventor: Hae Sock Chung , Byoung Hwa Lee , Min Cheol Park , Eun Hyuk Chae
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechancis Co., Ltd.
- Current Assignee: Samsung Electro-Mechancis Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery
- Priority: KR10-2012-0043976 20120426
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/30 ; H01G4/012 ; H01G4/232

Abstract:
There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 μm or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied.
Public/Granted literature
- US20130286535A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2013-10-31
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