Invention Grant
- Patent Title: Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes
- Patent Title (中): 通过瞬态液相烧结和聚合物焊膏进行电子元件端接和组装
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Application No.: US13114126Application Date: 2011-05-24
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Publication No.: US08902565B2Publication Date: 2014-12-02
- Inventor: John E. McConnell , John Bultitude , Reggie Phillips , Robert Allen Hill , Garry L. Renner , Philip M. Lessner , Antony P. Chacko , Jeffrey Bell , Keith Brown
- Applicant: John E. McConnell , John Bultitude , Reggie Phillips , Robert Allen Hill , Garry L. Renner , Philip M. Lessner , Antony P. Chacko , Jeffrey Bell , Keith Brown
- Applicant Address: US SC Simpsonville
- Assignee: Kemet Electronics Corporation
- Current Assignee: Kemet Electronics Corporation
- Current Assignee Address: US SC Simpsonville
- Agency: Perkins Law Firm, LLC
- Agent Joseph T. Guy
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/06 ; H01G4/30 ; B23K1/00 ; B23K1/20 ; B23K35/36 ; H01G4/232 ; B23K1/008 ; B23K35/02 ; H01G4/005 ; B23K1/005

Abstract:
A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.
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