Invention Grant
- Patent Title: Micro damper device
- Patent Title (中): 微阻尼装置
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Application No.: US13762494Application Date: 2013-02-08
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Publication No.: US08902578B2Publication Date: 2014-12-02
- Inventor: Kun-Ta Lee
- Applicant: Kun-Ta Lee
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW01219002U 20121001
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K7/00 ; G11B33/08

Abstract:
A micro damper device comprising a main body, a cover, a sensor component and a control component is provided. The main body has a first surface, a second surface, a convex and a coil. A current is introduced to the coil to form a magnetic field with a first and a second magnetic pole. The cover has a first end, a second end and a first magnetic component. The sensor component is disposed on a side opposite the convex to measure a first vibration direction of the second surface. The control component is electrically connected between the sensor component and the coil and controls the current for adjusting the polarity and the strength of the first magnetic pole for producing a force between the first magnetic pole and a third magnetic pole, which makes the main body move along a second vibration direction opposite the first vibration direction.
Public/Granted literature
- US20140092548A1 Micro Damper Device Public/Granted day:2014-04-03
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