Invention Grant
- Patent Title: Heat dissipation device
- Patent Title (中): 散热装置
-
Application No.: US13464507Application Date: 2012-05-04
-
Publication No.: US08902591B2Publication Date: 2014-12-02
- Inventor: Hao Jan Mou , Ta Wei Hsueh , Ying Lun Chang , Shih Chang Chen , Yung Lung Han , Chi Feng Huang
- Applicant: Hao Jan Mou , Ta Wei Hsueh , Ying Lun Chang , Shih Chang Chen , Yung Lung Han , Chi Feng Huang
- Applicant Address: TW Hsin-Chu
- Assignee: Microjet Technology Co., Ltd.
- Current Assignee: Microjet Technology Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201110128904 20110511
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
The present invention relates to a heat dissipation device, which comprises: a fluid, a fluid delivery device, and a circular pipe. The fluid delivery device is for propelling and delivering the fluid, the circular pipe is connected with the fluid delivery device, at least a portion of the circular pipe itself contacting with a heat generation device for conducting heat to the portion of the circular pipe, so as letting the fluid to be delivered by the fluid delivery device for delivering heat to the rest portion of the circular pipe, and to dissipate the heat generation device.
Public/Granted literature
- US20120287655A1 HEAT DISSIPATION DEVICE Public/Granted day:2012-11-15
Information query
