Invention Grant
US08902605B2 Adapter for plated through hole mounting of surface mount component
有权
表面安装元件的电镀通孔安装适配器
- Patent Title: Adapter for plated through hole mounting of surface mount component
- Patent Title (中): 表面安装元件的电镀通孔安装适配器
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Application No.: US13495671Application Date: 2012-06-13
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Publication No.: US08902605B2Publication Date: 2014-12-02
- Inventor: Daniel J. Buschel , Wai Mon Ma , James E. Tersigni , Raymond D. Birchall
- Applicant: Daniel J. Buschel , Wai Mon Ma , James E. Tersigni , Raymond D. Birchall
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Walter W. Duft
- Main IPC: H01R9/00
- IPC: H01R9/00

Abstract:
A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.
Public/Granted literature
- US20130337697A1 Adapter For Plated Through Hole Mounting Of Surface Mount Component Public/Granted day:2013-12-19
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