Invention Grant
- Patent Title: Electronic device
- Patent Title (中): 电子设备
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Application No.: US13540618Application Date: 2012-07-03
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Publication No.: US08902610B2Publication Date: 2014-12-02
- Inventor: Minoru Fukuda
- Applicant: Minoru Fukuda
- Applicant Address: JP Tokyo
- Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Jianq Chyun IP Office
- Priority: JP2011-149167 20110705; JP2012-095431 20120419
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/04 ; H05K5/00 ; H05K7/00 ; H05K1/18 ; H01F27/32 ; H05K3/30
Abstract:
An electronic device is provided. In the electronic device, a cover is securely fitted to a predetermined positioning hole formed in a printed board using a ready-made cover without using solder when the cover is installed in the printed board, so that the cover is prevented slipping from the printed board. The positioning hole is formed in a predetermined position of the printed board, and a cover claw that can be fitted to the positioning hole of the cover is formed in the cover, so that the cover covers the principal surface of the printed board to provide an electronic device.
Public/Granted literature
- US20130010438A1 ELECTRONIC DEVICE Public/Granted day:2013-01-10
Information query
