Invention Grant
US08902661B1 Block structure profiling in three dimensional memory 有权
三维内存中的块结构分析

Block structure profiling in three dimensional memory
Abstract:
Memory hole diameter in a three dimensional memory array may be calculated from characteristics that are observed during programming. Suitable operating parameters may be selected for operating a block based on memory hole diameters. Hot counts of blocks may be adjusted according to memory hole size so that blocks that are expected to fail earlier because of small memory holes are more lightly used than blocks with larger memory holes.
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