Invention Grant
- Patent Title: Block structure profiling in three dimensional memory
- Patent Title (中): 三维内存中的块结构分析
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Application No.: US14283912Application Date: 2014-05-21
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Publication No.: US08902661B1Publication Date: 2014-12-02
- Inventor: Deepak Raghu , Gautam A. Dusija , Chris Avila , Yingda Dong , Man Mui , Alexander Kwok-Tung Mak , Pao-Ling Koh
- Applicant: SanDisk Technologies Inc.
- Applicant Address: US TX Plano
- Assignee: SanDisk Technologies Inc.
- Current Assignee: SanDisk Technologies Inc.
- Current Assignee Address: US TX Plano
- Agency: Davis Wright Tremaine LLP
- Main IPC: G11C16/04
- IPC: G11C16/04 ; G11C16/10 ; G11C29/00 ; G11C16/26 ; H01L27/115

Abstract:
Memory hole diameter in a three dimensional memory array may be calculated from characteristics that are observed during programming. Suitable operating parameters may be selected for operating a block based on memory hole diameters. Hot counts of blocks may be adjusted according to memory hole size so that blocks that are expected to fail earlier because of small memory holes are more lightly used than blocks with larger memory holes.
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