A system for cooling electronic components is provided, the system comprising: a first electronic component having a first operating temperature; a second electronic component having a second operating temperature greater than the first operating temperature; a vapor compression loop configured to cool the first electronic component to the first operating temperature; a pumped cooling loop configured to cool the second electronic component to the second operating temperature; and a heat exchanger between the vapor compression loop and the pumped cooling loop, the heat exchanger configured to transfer heat from the pumped cooling loop to the vapor compression loop before the second electronic component is cooled and after the first electronic component is cooled.